Place of Origin: | China |
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Brand Name: | BAIYUN |
Model Number: | SKF323 |
Minimum Order Quantity: | Cartridge / Sausage Packaging 1000PCS;Drum Packaging 3Kits; |
Price: | Negotiation |
Packaging Details: | 300 ml / pc |
Delivery Time: | 7-14 days |
Payment Terms: | L/C, T/T |
Supply Ability: | Cartridge / Sausage Packaging 1000000PCS/month; Drum Packaging 10000 Kits / month; |
Volume: | 300ml | Application: | Electronic Components |
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Brand: | Baiyun | ||
High Light: | SKF323 Industrial Silicone Sealant,Silicone Glue For Electronic Components,alkoxy cure silicone |
SKF323 Industrial Silicone Sealants 300 ml / pc adhesion for electronic components
SKF323 Features
◆ One component, neutral alkoxy-cure silicone sealant.
◆ Excellent adhesion to a variety of substrates, including anodized aluminum, glass, ABS, PBT, PET, PVC, PC, etc.
◆ Excellent resistance to durability test: Passed thermal shock test(-40-85℃), damp-heat test(85℃/85%RH/1000 h), and so on related aging test.
◆ Excellent high and low temperature resistance, keeping stable performance within the range -50 ℃ ~ +180 ℃
Typical Applications
◆ Bonding and sealing of lamp products such as T8 tube, energy-saving lamp and automobile lamp;
◆ Structural bonding and sealing of various glass, aluminum and engineering plastics;
◆ Other industries need to bond or seal a variety of USES.
Typical Material Properties
Item | Typical | Test Standard |
Before curing | ||
Appearance | White or gray paste | Eye-measurement |
Density (g/cm3) | 1.6±0.02 | GB/T 13354-1992 |
Surface dry time (min) | 3~5 | GB/T13477.5-20 |
Extrusion rate (g/min) | ≥50 | 0.2MPa, 25℃, 4mm |
After total curing | ||
Hardness (shore-A) | 60±2 | GB/T 531-1999 |
Tensile Strength (MPa) | ≥1.1 | GB/T 528-1998 |
Elongation break (%) | ≥110 | GB/T 528-1998 |
Volume resistivity (Ω.cm) | ≥1.0×1013 | GB/T 1962-92 |
Dielectric strength (KV/mm) | ≥ | GB/T 1408.1-1999 |
Working temperature (℃) | -50-220 | / |
Noted: All the above data come from 23±2℃and 50±5%RH curing condations after 7days.
Instructions
◆The surface of substrate must be clean and dry, preferred solvents including isopropanol, acetone, and methyl ethyl ketone.For some special substrates, such as PP and PTEE, needed chemical corrosion or plasma treatment to meet bonding effect.
◆ Match pneumatic dispenser or machine to meet dispensing process.
◆After skin formation, cure continues inward from the surface. In 24 hours (at 25℃and 50% relative humidity). SMG533-S will cure to a depth of about 3.3 mm. The deep-seated part, especially the part that has limit contact with air has longer curing time. Similarly curing time would extend in low-temperature condition.
Packaging & Storage
Attention
The values in this document are not of all specifications and are subject to change without notice. As the actual situation is very different, it’s hard to guarantee the correctness and applicability of our products in some usage. Users should understand the product before using, and then decide the best way to use it.