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Company News About Read silicone thermally conductive potting adhesive in one article!

Read silicone thermally conductive potting adhesive in one article!

2024-11-13
Latest company news about Read silicone thermally conductive potting adhesive in one article!

   Read silicone thermally conductive potting adhesive in one article!

Today, let's walk into the wonderful world of silicone thermally conductive potting adhesive and see how it shines on the stage of science and technology!

 

    latest company news about Read silicone thermally conductive potting adhesive in one article!  0
1. The composition of silicone thermally conductive potting compound
    Silicone potting adhesive is a potting material composed of organic polysiloxane-based adhesive, crosslinker, catalyst, filler and other functional additives. It has the advantages of a wide range of operating temperatures, excellent thermal stability, good chemical stability, excellent electrical insulation properties, certain water resistance, weather resistance and UV resistance, easy molding and environmental protection. These advantages have led to a wide range of applications in silicone encapsulants.

2. Classification of silicone thermally conductive potting compounds
    Depending on the composition of the encapsulant, silicone encapsulants can be divided into two categories: one-component and two-component. Among them, the main advantage of one-component potting compound is that it can be used directly, without deaeration, and is easy to operate; Two-component silicone encapsulants need to mix a liquid base adhesive with a catalyst or crosslinker, so they are generally used for insulating encapsulation materials or airtight shock-absorbing and waterproof materials.
According to the different curing mechanisms, silicone encapsulants are divided into two systems: condensation type and addition molding system. Among them, the addition of silicone potting adhesive has many advantages, such as no by-products during curing, deep vulcanization, small shrinkage, and rapid curing at room temperature or heating, so it is widely used in the field of electronic potting.

3. Thermal conductivity: the "superpower" of silicone potting adhesive
    Pure silicone encapsulants have poor thermal conductivity, which makes it difficult to meet the requirements of stability and heat dissipation for electrical appliances due to the densification and miniaturization of electronic components. Therefore, it is of great significance for the development of the modern electronics industry to endow the silicone encapsulant with a thermal conductive function.
The easiest way to prepare silicone thermally conductive potting adhesives is to add some highly thermally conductive fillers to silicone-based adhesives. The type and properties of the thermal conductive filler have an impact on the thermal conductivity of the potting compound, but the thermal conductivity of the thermally conductive potting compound mainly depends on the interaction between the polymer matrix and the thermally conductive filler.
The key to obtaining high thermal conductivity potting compound material is to form an effective thermal conductive network chain inside the material: after the filling content of thermal conductive filler reaches a certain critical value, a thermal conductivity path similar to a network structure will be formed inside the composite material, so that the thermal conductivity of the potting compound will be significantly improved.

4. there is a "mystery" of thermal conductive fillers
   There are many types of thermal conductive fillers, mainly including metal powders, metal oxides and nitrides, carbon materials, etc. In general, filler filling with high thermal conductivity can produce composites with high thermal conductivity.

At the same time, the use of fillers with different particle sizes can help the fillers to better form a thermal conductivity path with each other, and the small particle size fillers can fill the gaps between the large particle size fillers, so as to significantly improve the overall thermal conductivity.
  The surface treatment and processing of the filler allows the silicone and the filler to be better bonded, reducing the thermal resistance between them, and making the silicone system less viscous and allowing more fillers to be added. In this way, the final silicone has good thermal conductivity and is easy to process. However, the key to achieving the best thermal conductivity and overall performance is to properly select and improve the filler and to mix it appropriately.

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